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Tau3p-Based Interactive Design Automation Software--Simulation Technology & Applied Research, 11520 North Port Washington Road, Suite 101B, Mequon, WI  53092-1195; 262-240-0291

Dr. John F. DeFord, Principal Investigator, john.deford@staarinc.com 

Dr. John F. DeFord, Business Official, john.deford@staarinc.com 

DOE Grant No. DE-FG02-01ER83322

Amount:  $99,667

 

Tau3p is a new, massively parallel, finite-element-based, time-domain analysis tool that computes electromagnetics fields inside accelerator components in unprecedented detail and accuracy.  Despite the tremendous potential of Tau3p to reduce the design costs of new accelerators, there is presently no generally accessible user-interface that makes the generation of models and interpretation of data sufficiently simple for use by design engineers and scientists within the DOE accelerator community.   This project will integrate Tau3p into the Analyst analysis package that supports other parallel solvers developed at Stanford Linear Accelerator Center, thereby providing a sophisticated, easy-to-use interface.   Phase I will create a prototype of the proposed system that consists of Tau3p linked to Analyst via a new analysis server, with meshing support provided by an external hexahedral gridder.   Preliminary versions of both a local and remote analysis server based on Tau3p will be implemented, transparently supporting analysis on either the local computer  or on a remote, possibly parallel, computer.

 

Commercial Applications And Other Benefits as described by the awardee: Highly detailed and accurate time-domain analysis of electromagnetic fields should provide substantial reductions in hardware design time over traditional driven-frequency methods.  The interface for Tau3p should make accurate time-domain analysis widely available, potentially reducing accelerator component design costs within the high-energy physics community.  Improved design capability should also be a possibility for a broad range of commercial hardware, including computer, telecommunications, and microwave components.

 

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